Production Overview
Plastic Transistor Outline packaging (SIP) is a principal package using TH or SMD technology. It is widely used in low cost and manual applications. FSMC offers SIP3,SIP4,SIP8 packages.
Application
System In Packages are considered one of the most established industry standard packages. SIP is commonly used Hall IC，Horn power amplifier protection IC，Leakage protector in circuit,etc.
Features
* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound
Design Rule
| Wafer Thickness |
|
80~280um |
Minimum Sawing
Street Width |
|
≥60um |
| Minimum die Size |
|
0.20mm*0.20mm |
| Maximum wafer Size |
|
D≤200mm |
Package Outline
| SIP series (All units are in mm) |
|
|
|
| Number |
PKG TYPE |
Lead count |
Lead Width |
Lead Thickness |
bond pad |
POD |
| 1 |
SIP-3 |
3 |
0.39 |
0.40 |
DOWN |
DOWN |
| 2 |
SIP-4 |
4 |
0.43 |
0.37 |
DOWN |
DOWN |
| 3 |
SIP-8 |
8 |
0.55 |
0.33 |
DOWN |
DOWN |
Packing & Shipping
| Tube: |
|
|
|
|
|
|
| Number |
PKG TYPE |
QTY/Tube |
Tube/Inner Box |
Total per inner box |
Boxe/case |
Total per case |
| 1 |
SIP-8 |
25 |
80 |
2000 |
10 |
20000 |
| Bulk: |
|
|
|
|
|
|
| Number |
PKG TYPE |
QTY/Bag |
Bag/Inner Box |
Total per inner box |
Boxe/case |
Total per case |
| 1 |
SIP-3 |
1000 |
10 |
10000 |
10 |
100000 |
| 2 |
SIP-4 |
1000 |
10 |
10000 |
10 |
100000 |
|
